2nd European Conference on Electrical Engineering & Computer Science


2nd European Conference on Power Electronics
as part of EECS 2018
(Bern, Switzerland, December 20-22, 2018)

   

Upload your paper: http://www.eecs-conf.org/upload.html

The proceedings will be published by Conference Publishing Services (CPS) https://www.computer.org/web/guest/home

ISI Thomson's Scientific and Technical Proceedings, ISTP/ISI Proceedings, EI's Engineering Information Index, EI Compendex, DBLP, ACM, SCOPUS, Google Scholar as well as in the Data Bases IEEEXplore and CSDL.

* Extended versions will be published in various reputable journals (indexed in IET, ISI, SCOPUS etc...)


Committee:
Prof. Cornelia Aida Bulucea, University of Craiova, Craiova, Romania
Prof. Germano Lambert-Torres, Itajuba, MG, Brazil
Prof. George Vachtsevanos, Georgia Institute of Technology, Atlanta, Georgia, USA
Prof. Imre J. Rudas, Obuda University, Budapest, Hungary
Prof. Haitham Abu-Rub, IEEE Fellow, Texas A&M University, TX, USA 
Prof. Richard A. Lukaszewski, IEEE Fellow, Rockwell Automation, 6400 West Enterprise Drive Mequon, WI., USA
Prof. Shengyi Liu, Ph.D., IEEE Fellow, Chief Architect of Platform Subsystems, Boeing Research & Technology, USA

Prof. Stefanos Manias, National Technical University of Athens, Greece
Prof. George J. Tsekouras, University of West Attica, Greece
Prof. Jiri Klima, Technical faculty of CZU in Prague, Czech Republic
Prof. Ioannis F. Gonos, National Technical University of Athens, Greece
Prof. Igor Kuzle, Faculty of electrical engineering and computing, Zagreb, Croatia
Prof. Mario Luiso, Second University of Naples, Naples, Italy


Topics: 
Power conversion
Power Control
Power semiconductors
DC-to-DC Converters
Inverters
Off-line switching power supplies, 
Rectifiers,control techniques, 
Power circuit components
Power Electronics for Renewable Energy Sources
Wireless Power Transfer 
Thermal performance of electronic power systems
Transportation Electrification 
Automation and Motion
Industrial Electronics
Aircraft, Railway, Ship Propulsion
Integrated Power Packaging
Modeling, analysis and simulation techniques